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Core Functions & التطبيقات
The Floor-Standing Dual-Platform Soldering Machine is a floor-mounted automated device built with two independent work platforms, specialized in precise soldering of electronic components like PCBs, connectors, automotive sensors, and microchips. Its core value lies in the dual-platform alternating operation: when one platform runs soldering (via laser, hot air, or soldering iron), operators can load/unload workpieces or preset parameters on the other—completely eliminating idle time and lifting production efficiency by 80-120% compared to single-platform models.
Equipped with a CCD vision positioning system and PID temperature control, it ensures sub-millimeter soldering accuracy (up to ±0.01mm) and stable temperature (180-480°C, fluctuation ≤±2°C), avoiding cold joints, excess solder, or thermal damage to sensitive parts. It automates solder wire feeding (0.1-1.2mm diameter) and supports post-soldering visual checks, replacing error-prone manual soldering for consistent joint quality.
Widely used in high-volume manufacturing, it fits industries such as consumer electronics (batch soldering of smartphone motherboards), إلكترونيات السيارات (ECU and sensor assembly), and industrial control (circuit board soldering), meeting strict standards for reliability and production speed.
Key Technical Features
Dual-Platform Efficiency: Alternating work of two platforms cuts downtime, perfectly matching mass production needs.
Stable Floor-Mounted Structure: Heavy-duty frame reduces vibration during long-hour operation, ensuring consistent soldering precision.
Vision-Guided Precision: CCD camera + AI image processing automatically identifies solder joints and adapts to workpiece position deviations.
Flexible Adaptation: Supports laser, hot air, and iron soldering modes; stores 100+ programs for quick switching between component types.
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