Electronic manufacturing faces growing challenges with hidden defects in dense packaging and complex assemblies, and the 2.5डी एक्स-रे निरीक्षण उपकरण offers a cost-effective solution. It uses angled perspective to reveal internal flaws that 2D systems miss, balancing accuracy and production efficiency for critical electronic components.
SMT & PCB Assembly: Uncovering BGA & Hidden Solder Defects
Firstly, BGA, CSP, and QFN components have hidden solder joints that evade AOI inspection. The 2.5D X-RAY Inspection Equipment tilts its X-ray source up to ±60° to generate angled images, clearly identifying pillow effects, cold solder, and microcracks in these critical connections.
Moreover, it accurately measures solder void rates—critical for automotive and aerospace PCBs—and flags excessive voids that risk thermal or electrical failure. This solution resolved a major ECU communication issue for one automaker by detecting micron-level BGA solder separation that 2D X-ray missed, cutting field failures by 70%.
Semiconductor Packaging: Verifying Internal Structural Integrity
Semiconductor packages (such as wire-bonded ICs and flip-chips) require inspection of internal wires, die attach, and encapsulation. The 2.5D X-RAY Inspection Equipment penetrates epoxy casings to check for wire sweep, die shift, and delamination without damaging components.
इसके अतिरिक्त, its high-resolution imaging (down to 4μm) captures subtle defects like cracked bonding wires or insufficient die attach adhesive. This helps packaging facilities comply with strict quality standards, reducing early-stage component failures in end products.
High-Density PCB & HDI Board Testing: Navigating Layered Complexity
Secondly, HDI boards and multi-layer PCBs have overlapping internal traces and blind/buried vias that are impossible to inspect visually. The 2.5D X-RAY Inspection Equipment uses multi-angle imaging to distinguish between layers, detecting short circuits, open vias, and improper solder fill in these dense structures.
Furthermore, it integrates with PCB drilling lines to form a closed-loop system, adjusting processes in real-time to fix recurring via defects. This solution reduced a server manufacturer’s PCB scrap rate by 22% by identifying hidden drill smear and copper residues in inner layers.
Electronic Component Quality Control: Screening Internal Flaws
Passive components like MLCCs, capacitors, and connectors often have internal defects (such as cracks or foreign particles) that cause in-field failures. The 2.5D X-RAY Inspection Equipment screens these components before assembly, detecting structural weaknesses that standard electrical tests miss.
For example, it uncovered a batch of MLCCs with hidden stress cracks from poor handling, preventing them from being used in consumer electronics and avoiding costly recalls. Its ability to handle diverse materials—from ceramic to plastic—makes it versatile for component incoming inspection.
Production Line Integration: Balancing Speed & Precision
अंत में, modern electronic factories need inspection tools that match high-volume production speeds. The 2.5D X-RAY Inspection Equipment supports CNC-programmed automatic batch testing, completing inspections of 400mm×460mm PCBs in under 60 seconds while maintaining 0.01mm measurement accuracy.
Its low radiation emission (<1μSv/h) ensures workplace safety, and its compatibility with MES systems enables full defect traceability. This solution offers a middle ground between slow, expensive 3D CT systems and limited 2D X-ray, delivering the right balance for most high-volume production lines.
Core Value: Cost-Effective Precision for Modern Electronics
The 2.5D X-RAY Inspection Equipment combines angled imaging capability, high resolution, and user-friendly operation. It eliminates the need for destructive testing and reduces reliance on operator experience, ensuring consistent defect detection across shifts.
In electronic manufacturing, it’s not just an inspection tool—it’s a solution that safeguards product reliability, reduces warranty costs, and enables the production of increasingly miniaturized and complex electronic devices.
जेट्रॉनल इंस्ट्रूमेंट्स कंपनी, लिमिटेड. has specialized in the electronic measurement field for 35 years, covering various measurement needs across the entire electronic industry chain and providing precise measurement support.
