तकनीकी अनुप्रयोग & मामलों

चौड़ी-चौड़ाई वाला वायुमंडलीय प्लाज्मा क्लीनर: इलेक्ट्रॉनिक विनिर्माण समाधान

चौड़ी-चौड़ाई वाला वायुमंडलीय प्लाज्मा क्लीनर 1002006

इलेक्ट्रॉनिक विनिर्माण उत्पाद की विश्वसनीयता के लिए दोषरहित सतह आसंजन और सफाई पर निर्भर करता है, और यह चौड़ी-चौड़ाई वाला वायुमंडलीय प्लाज्मा क्लीनर delivers this efficiently. It solves adhesion issues and contamination problems without chemicals, supporting high-volume production lines.

पीसीबी & FPC Production: Enhancing Bonding & विश्वसनीयता

पहले तो, PCBs and FPCs accumulate flux residues, oxidation, and dust during fabrication, which harm soldering and bonding. The Wide-Width Atmospheric Plasma Cleaner removes these contaminants and activates surfaces, boosting copper foil surface energy significantly.

इसके अतिरिक्त, its wide processing width (up to 800mm) matches PCB panel sizes, enabling in-line integration. This solution reduces焊接 defects from 8% को 0.5% and improves HDI board via reliability by eliminating drill smear.

Display Panel Manufacturing: Reducing Bonding Bubbles

LCD and OLED panels require perfect bonding between glass and touch modules. The Wide-Width Atmospheric Plasma Cleaner treats surfaces before lamination, minimizing bubbles caused by organic contaminants.

इसके अतिरिक्त, it lowers the surface contact angle to below 20°, enhancing OCA optical adhesive adhesion. This solves the common issue of post-lamination bubble reoccurrence, cutting rework rates by over 60%.

सेमीकंडक्टर पैकेजिंग: Boosting Bonding Strength

दूसरे, semiconductor packaging (तार का जोड़, flip-chip) needs oxide-free, activated surfaces for strong connections. The Wide-Width Atmospheric Plasma Cleaner removes resin residues from solder bumps and cleans lead frames gently.

आगे, its low-temperature process (below 60°C) avoids damaging sensitive components. This solution improves flip-chip bump retention by three times and doubles mold resin adhesion strength, preventing delamination.

Battery Module Production: Ensuring Electrical Safety

EV battery BMS boards and cell tabs require clean surfaces for reliable soldering and bonding. The Wide-Width Atmospheric Plasma Cleaner removes grease and oxidation without damaging热敏 elements.

उदाहरण के लिए, it increases conductive adhesive bonding strength by 300% on polyimide substrates. This solution extends battery module lifespan and raises insulation coating salt spray resistance by three times.

In-Line Manufacturing: Enabling Green & High-Speed Production

अंत में, modern electronic factories prioritize efficiency and sustainability. The Wide-Width Atmospheric Plasma Cleaner operates at atmospheric pressure, eliminating bulky vacuum systems and cutting energy use by 40%.

Its compatibility with roll-to-roll and sheet processing (speeds up to 3m/min) supports 24/7 उत्पादन. It also replaces chemical solvents, reducing annual VOCs emissions by 2.3 tons per unit, meeting RoHS standards.

कोर मूल्य: क्षमता, गुणवत्ता & Sustainability in One

The Wide-Width Atmospheric Plasma Cleaner combines wide coverage, non-contact processing, and real-time monitoring. It outperforms traditional cleaning methods by balancing speed, शुद्धता, and environmental friendliness.

इलेक्ट्रॉनिक विनिर्माण में, it’s not just a cleaner—it’s a solution that boosts yields, लागत कम कर देता है, and enables the production of high-reliability devices from smartphones to EV components.

जेट्रॉनल इंस्ट्रूमेंट्स कंपनी, लिमिटेड. के लिए इलेक्ट्रॉनिक माप क्षेत्र में विशेषज्ञता प्राप्त है 35 साल, संपूर्ण इलेक्ट्रॉनिक उद्योग श्रृंखला में विभिन्न माप आवश्यकताओं को कवर करना और सटीक माप समर्थन प्रदान करना.

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