This system is designed for surface treatment in industries such as FPC & プリント基板, composite materials, ガラス, and ITO. It features a built-in cooling system to enhance durability and performance.
製品の特徴:
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Supports fully automated plasma cleaning for FPC & プリント基板, 複合材, ガラス, and ITO surfaces.
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Patented built-in cooling system ensures extended service life and stable performance.
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Enables flexible on-line integration with electron/ion energy exceeding 10eV, delivering processing efficiency over 10 低圧グロー放電システムよりも数倍高い.
アプリケーション:
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Removes glue residue and enhances copper adhesion in high-aspect-ratio double-layer FPC and rigid-flex boards.
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Activates PTFE hole walls for improved copper bonding, preventing black holes and blowholes.
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Cleans carbon deposits from laser-drilled microvias in HDI boards, even for sub-50μm diameters.
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Eliminates dry film residuals during fine circuit manufacturing.
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Treats PI surfaces to increase adhesion strength by over 10 times before lamination or reinforcement.
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Cleans fingers and pads before chemical gold plating/electroplating to remove contaminants and improve adhesion.
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Enhances solderability and reduces defects before SMT processes.
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Prepares PCB surfaces for BGA packaging, wire bonding, and EMC encapsulation.
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Cleans LCD module gold fingers and polarizer surfaces to eliminate contaminants.
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Removes oxides and organic residues from semiconductor wafers and cleans COB/COG/COF/ACF contaminants.
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Treats LED bonding pads to remove organic compounds before wire bonding.
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Activates surfaces of plastics, ガラス, ceramics, and polypropylene to improve printing, coating, and adhesion.
