Copper Substrate Product Introduction
Ini Substrat tembaga is an industrial-grade electronic substrate with precise specifications for reliable performance. This Copper Substrate has a board thickness of 1.6MM and adopts the exposure process for production—this process ensures high manufacturing precision, laying a solid foundation for stable circuit operation. Its copper foil thickness reaches 4OZ, which boosts current-carrying capacity and heat transfer efficiency, making it suitable for high-power electronic scenarios.
It delivers a withstand voltage of AC 2500-4000V, ensuring safe use in medium-to-high voltage electronic circuits without breakdown risks. Its thermal conductivity hits 398W/m·K, a high value that quickly dissipates heat from components, preventing overheating and extending the service life of electronic devices.
For quality, it holds multiple certifications: ULE354470, ISO, SGS, and IATF16949, fully meeting global industrial standards. It uses blue solder mask as the 阻焊 type and features immersion gold surface finish—this finish enhances corrosion resistance and ensures strong solderability for subsequent assembly.
We perform 100% computerized open/short testing (E-T Test) on all substrates to eliminate defective products. In terms of lead time, samples are ready in 1-3 days, and mass production orders take 5-7 days, effectively supporting customers’ fast prototyping and production schedules.
Substrat tembaga
