Wide-Width Atmospheric Plasma Cleaner
This system is designed for surface treatment in industries such as FPC & PCB, composite materials, glass, and ITO. It features a built-in cooling system to enhance durability and performance.
Product Features:
-
Supports fully automated plasma cleaning for FPC & PCB, composites, glass, and ITO surfaces.
-
Patented built-in cooling system ensures extended service life and stable performance.
-
Enables flexible on-line integration with electron/ion energy exceeding 10eV, delivering processing efficiency over 10 times higher than low-pressure glow discharge systems.
Applications:
-
Removes glue residue and enhances copper adhesion in high-aspect-ratio double-layer FPC and rigid-flex boards.
-
Activates PTFE hole walls for improved copper bonding, preventing black holes and blowholes.
-
Cleans carbon deposits from laser-drilled microvias in HDI boards, even for sub-50μm diameters.
-
Eliminates dry film residuals during fine circuit manufacturing.
-
Treats PI surfaces to increase adhesion strength by over 10 times before lamination or reinforcement.
-
Cleans fingers and pads before chemical gold plating/electroplating to remove contaminants and improve adhesion.
-
Enhances solderability and reduces defects before SMT processes.
-
Prepares PCB surfaces for BGA packaging, wire bonding, and EMC encapsulation.
-
Cleans LCD module gold fingers and polarizer surfaces to eliminate contaminants.
-
Removes oxides and organic residues from semiconductor wafers and cleans COB/COG/COF/ACF contaminants.
-
Treats LED bonding pads to remove organic compounds before wire bonding.
-
Activates surfaces of plastics, glass, ceramics, and polypropylene to improve printing, coating, and adhesion.
