Aluminum Substrate Product Introduction
First, this Алюминиевая подложка is a high-performance electronic substrate for industrial use, with strict technical specs. This Aluminum Substrate has a 2.0MM board thickness and uses the exposure process. The exposure process ensures precise circuit patterning, which supports stable component operation. It also has 3OZ copper foil thickness—this balances current-carrying capacity and structural stability for medium-power electronics.
Кроме того, it offers a withstand voltage of AC 2500-6000V. This provides reliable insulation for high-voltage circuits, avoiding breakdown risks during use. Its thermal conductivity is 210W/m·K, an efficient level that speeds up heat dissipation from components. This prevents overheating and extends the lifespan of electronic devices.
For quality assurance, it holds multiple authoritative certifications: ULE354470, ISO, SGS, and IATF16949. These meet global industrial standards for safety and reliability. It uses black solder mask as the resist type and has immersion gold surface treatment. This treatment boosts corrosion resistance and ensures strong solderability for later assembly.
Finally, we conduct 100% computerized open/short testing (E-T Test) on all substrates. This eliminates defective products before delivery. In terms of lead time, samples are ready in 1-3 days. Mass production orders take 4-5 days—this supports customers’ fast prototyping and production schedules.
Алюминиевая подложка
