The Inline PCB Laser Depaneling Machine integrates seamlessly into production lines, offering precise, non-contact cutting of printed circuit boards (プリント基板). It uses high-energy laser beams to separate PCB panels into individual units, ensuring minimal stress on components and avoiding mechanical damage common with traditional blade-based methods. This inline machine handles various PCB materials—including FR4, aluminum substrates, and flexible PCBs—with cutting accuracy up to ±0.02mm, making it ideal for high-density, fine-pitch PCB assemblies.
Equipped with a conveyor system, the Inline PCB Laser Depaneling Machine enables continuous processing at speeds of 1-3 meters per minute, matching the throughput of automated production lines. It features intelligent laser power control and vision positioning, adapting to different board thicknesses (0.2-3mm) and cutting paths without manual adjustments. Operators can program cutting patterns via software, and the machine supports data integration with MES systems for real-time production tracking.
Widely used in electronics manufacturing—especially for consumer electronics, automotive PCBs, and medical device circuits—this inline laser depaneling machine ensures clean, burr-free edges, reduces post-processing steps, and enhances overall production efficiency. Its non-contact operation also lowers the risk of static damage to sensitive components, maintaining PCB integrity throughout the process.
