I. Cleaning Principle
The plasma cleaning machine process involves introducing different reactive gases based on the material’s properties to generate plasma under vacuum and discharge.
Two electrodes are set up in a sealed container to create a magnetic field, and a vacuum pump is used to maintain a certain vacuum level. ガスがますます希薄になると、, the distance between molecules and the free movement of molecules or ions increases. 電磁場の影響下で, collisions occur, forming a plasma.
At the same time, a glow discharge occurs, and the plasma moves within the electromagnetic field, “砲撃” the surface of the material being cleaned, changing its surface properties (cleaning, 荒らし, or etching it), increasing surface activation energy, and improving surface adhesion.
Surface treatment using a plasma cleaning machine enhances the “bonding” strength of the material during the process, further improving product performance and yield, while being harmless to humans, 材料, そして環境.
II. Application Industries
Primarily used in the manufacturing of semiconductors (LEDs/ICs/PCBs), consumer electronics (携帯電話, ラップトップ), 航空, プラスチック, 自動車, 生物医学的, and hardware.
