Fully Automatic X-RAY Inspection Equipment
The Fully Automatic X-RAY Inspection Equipment is a high-precision non-destructive testing device designed to inspect internal structures and defects of products without damaging them. It utilizes X-ray penetration technology combined with automated systems to perform comprehensive inspections on components such as electronic assemblies, PCBs, semiconductor packages, batteries, and metal castings.
Core Functions
Automated Inspection Process: Integrates automatic loading/unloading, X-ray imaging, and data analysis into a seamless workflow. It can continuously inspect batches of products without manual intervention, significantly improving testing efficiency.
High-Resolution Imaging: Equipped with high-definition detectors and advanced X-ray sources, it generates clear images of internal structures, enabling detection of hidden defects like voids, cracks, delaminations, and misalignments.
Intelligent Defect Recognition: Uses AI-based image processing algorithms to automatically identify and classify defects, with customizable criteria to meet specific industry standards. It provides quantitative data (e.g., void percentage, solder joint quality) for objective evaluation.
Key Technical Features
High Precision: Achieves spatial resolution up to a few microns, ensuring detection of even micro-scale defects in high-density electronic components.
Versatile Adaptability: Supports various product sizes and types, with adjustable X-ray parameters (voltage, current) to match different material thicknesses and densities.
Data Traceability: Automatically stores inspection images, defect reports, and test parameters, facilitating quality tracking and process optimization.
Safety Protection: Equipped with multiple safety interlocks, radiation shielding, and real-time radiation monitoring to ensure operator safety and compliance with radiation safety standards.
Application Fields
Widely used in electronics manufacturing (inspecting BGA, CSP, and PCB solder joints), semiconductor industry (wafer and package inspection), battery production (internal structure and short circuit detection), and automotive parts manufacturing (casting defect inspection).
Fully Automatic X-RAY Inspection Equipment
