This medium-sized plasma cleaning machine offers a powerful solution for batch production of small-volume products, effectively addressing various process challenges.
Depending on the properties of the materials being cleaned, different reactive gases are introduced to generate plasma under specific conditions such as vacuum and electric discharge. The core working principle involves two electrodes placed in a sealed chamber to create an electromagnetic field, while a vacuum pump maintains a certain level of vacuum. As the gas becomes increasingly rarefied, the distance between molecules expands, and their free movement intensifies. Under the influence of the electromagnetic field, collisions between particles occur, leading to the formation of plasma.
Simultaneously, glow discharge takes place, and the plasma moves directionally within the electromagnetic field, “bombarding” the surface of the material. This process alters the surface properties—such as through cleaning, roughening, or etching—thereby increasing surface activation energy and improving adhesion.
Surface treatment with this plasma cleaning machine significantly enhances the bonding strength of materials during subsequent processes, leading to improved product performance and higher production yield. It is safe for operators, materials, and the environment.
The machine is widely used in semiconductors (LEDs, ICs, PCBs), 3C consumer electronics (mobile phones, laptops), aviation, plastics, ยานยนต์, biomedical, hardware, and other manufacturing fields.
