TÔI. Cleaning Principle
The plasma cleaning machine process involves introducing different reactive gases based on the material’s properties to generate plasma under vacuum and discharge.
Two electrodes are set up in a sealed container to create a magnetic field, and a vacuum pump is used to maintain a certain vacuum level. Khi khí ngày càng trở nên hiếm, the distance between molecules and the free movement of molecules or ions increases. Dưới tác dụng của điện trường, collisions occur, forming a plasma.
Đồng thời, a glow discharge occurs, and the plasma moves within the electromagnetic field, “ném bom” the surface of the material being cleaned, changing its surface properties (cleaning, làm nhám, or etching it), increasing surface activation energy, and improving surface adhesion.
Surface treatment using a plasma cleaning machine enhances the “sự gắn kết” strength of the material during the process, further improving product performance and yield, while being harmless to humans, nguyên vật liệu, và môi trường.
II. Application Industries
Primarily used in the manufacturing of semiconductors (LEDs/ICs/PCBs), điện tử tiêu dùng (điện thoại di động, máy tính xách tay), hàng không, nhựa, ô tô, y sinh, and hardware.
