Semiconductor manufacturing and packaging demand strict defect control, and the อุปกรณ์ตรวจสอบด้วยภาพสี่ด้านชิปอัตโนมัติ is a core tool. It checks all four sides of chips simultaneously, solving hidden defect issues that threaten product reliability.
Wafer Dicing Stage: Detecting Post-Dicing Defects
Firstly, wafer dicing often causes micro-cracks, chipping, or edge burrs on chip sides. The Automatic Chip Four-Side Visual Inspection Equipment uses high-resolution cameras to capture these flaws at the dicing stage.
Moreover, it integrates with dicing machines for real-time inspection, triggering alerts immediately when defects are found. This solution prevents defective chips from entering the next process, reducing wafer material waste by 30%.
Chip Packaging: Ensuring Lead & Bump Integrity
During packaging, chip leads (pins) or solder bumps may have deformation, missing parts, or oxidation. The Automatic Chip Four-Side Visual Inspection Equipment inspects these key structures from all four angles.
นอกจากนี้, it supports multi-chip package (MCP) inspection, adapting to complex packaging designs. Engineers use this data to adjust packaging parameters, solving issues like poor solderability that cause assembly failures.
High-Speed Production Lines: Matching Mass Manufacturing Needs
Secondly, semiconductor factories run high-speed production lines that require fast inspection. The Automatic Chip Four-Side Visual Inspection Equipment achieves inspection speeds of up to 1200 chips per minute.
Furthermore, its AI-powered image processing reduces false positives by 45% compared to traditional systems. This solution balances speed and accuracy, meeting the throughput requirements of mass chip production.
Advanced Semiconductor Chips: Adapting to Miniaturization
Miniaturized chips (เช่น, 3nm, 2nm process) have smaller features that are harder to inspect. The Automatic Chip Four-Side Visual Inspection Equipment uses ultra-high-definition (UHD) lenses and multi-spectrum lighting.
For example, it detects sub-micron-level scratches on 3nm chip sides that are invisible to standard equipment. This solution supports the development of advanced semiconductors, ensuring quality in cutting-edge processes.
การควบคุมคุณภาพ & Traceability: Meeting Industry Standards
ในที่สุด, semiconductor manufacturers need traceable quality data to comply with ISO and automotive-grade standards. The Automatic Chip Four-Side Visual Inspection Equipment logs inspection results for each chip.
Its data integration function connects to factory MES systems, creating a complete quality audit trail. This solution solves traceability challenges, helping manufacturers meet strict industry certification requirements.
Core Value: Safeguarding Semiconductor Quality & Efficiency
The Automatic Chip Four-Side Visual Inspection Equipment combines 360° inspection capability, high speed, and AI intelligence. It replaces manual inspection, eliminating human error and reducing labor costs.
In semiconductor manufacturing and packaging, it’s not just inspection equipment—it’s a solution that ensures chip reliability, accelerates production, and supports the growth of the global semiconductor industry.
บริษัท เจทรอน อินสทรูเมนท์ส จำกัด, จำกัด. has specialized in the electronic measurement field for 35 years, covering various measurement needs across the entire electronic industry chain and providing precise measurement support.
