2.5معدات الفحص D X-RAY
2.5D X-RAY Inspection Equipment is an advanced non-destructive testing device that combines partial features of 2D and 3D X-RAY inspection. It can provide more comprehensive internal structure information than traditional 2D X-RAY equipment, while avoiding the higher cost and more complex operation of full 3D X-RAY systems.
Core Functions
Enhanced 2D Imaging with Depth Sensing: It not only generates clear 2D projection images of the tested object (على سبيل المثال, electronic components, PCBs) but also uses technologies like layered scanning or tomosynthesis to capture depth-related information. This allows distinguishing defects or structures at different vertical layers (على سبيل المثال, differentiating solder joints on upper and lower layers of a multi-layer PCB).
Precise Dimensional Measurement: Based on depth-sensing data, it can accurately measure key 3D-related dimensions that 2D systems cannot, such as the height of solder bumps, the thickness of internal material layers, and the vertical distance between components—with measurement accuracy up to ±1 μm.
Targeted Defect Detection: Focuses on detecting “quasi-3D” defects that are difficult to identify with 2D X-RAY, such as uneven solder joint height, partial delamination of semiconductor packages, and voids distributed in specific vertical layers of batteries.
Key Technical Features
Balanced Performance & Cost: Offers depth-aware inspection capabilities closer to 3D systems, while having a lower purchase and maintenance cost than full 3D X-RAY equipment, making it suitable for medium-to-high precision testing needs.
Efficient Scanning: Adopts rapid layered scanning technology, with inspection speed 2–3 times faster than full 3D tomography, ensuring compatibility with batch production lines (على سبيل المثال, PCB assembly, semiconductor packaging).
Intuitive Data Analysis: Equipped with dedicated software that overlays depth information onto 2D images (على سبيل المثال, color-coded depth maps) or generates cross-sectional views at arbitrary positions, enabling operators to quickly locate and evaluate internal defects.
Broad Compatibility: Supports testing of various products, including small electronic components (BGA, CSP), multi-layer PCBs, lithium-ion battery cores, and precision mechanical parts—with adjustable X-ray parameters to adapt to different material thicknesses (0.1 mm–10 mm).
Typical Application Fields
Electronics Manufacturing: Inspecting solder joint quality (height, void rate) of multi-layer PCB components, detecting internal short circuits/layer misalignment of flexible PCBs.
Semiconductor Packaging: Evaluating the bonding quality of chip-on-board (COB) packages, checking delamination between semiconductor die and substrate, and measuring the height of solder balls in flip-chip packages.
Battery Production: Detecting voids in the electrode layers of lithium-ion batteries, verifying the alignment of internal tabs, and inspecting the uniformity of electrolyte distribution (in semi-transparent battery cases).
2.5معدات الفحص D X-RAY
