Équipement automatique de soudage à la vague sélective is automates precise soldering for specific areas of PCBs, targeting through-hole components without affecting surface-mounted parts. It uses precise nozzle positioning to apply solder, controlling temperature and flow to ensure strong, consistent joints—ideal for complex PCBs with mixed component types.
Largement utilisé dans la fabrication électronique, including automotive electronics, industrial control boards, and medical devices. It supports various solder types (lead-free, tin-lead) and adapts to diverse PCB sizes, reducing solder waste and improving efficiency compared to traditional wave soldering.
Automatic Selective Wave Soldering Equipment delivers targeted, precise soldering for through-hole components on complex PCBs, avoiding damage to surface-mounted parts. It uses advanced nozzle positioning to apply solder only to specified areas, controlling temperature and flow with pinpoint accuracy to ensure strong, consistent joints—critical for electronics with mixed component types.
This equipment excels in automotive electronics, industrial control boards, and medical device manufacturing. It supports both lead-free and tin-lead solder, adapting to diverse PCB sizes and layouts with adjustable parameters that simplify switching between production runs. Compared to traditional wave soldering, it reduces solder waste and minimizes post-soldering cleanup, cutting operational costs.
What sets this Automatic Selective Wave Soldering Equipment apart is its focus on flexibility and precision. The intuitive interface lets operators program soldering patterns quickly, while built-in sensors monitor temperature and flow to prevent defects like cold solder or bridges. Its compact design integrates easily into existing production lines, supporting high-volume runs without sacrificing accuracy.
For electronics manufacturers needing reliable, targeted soldering for complex PCBs, this equipment balances efficiency and precision—helping meet strict industry standards and accelerate time-to-market for critical electronic components.
| Paramètre | EL9W5050ZD1A | EL9W6060ZD1A |
|---|---|---|
| Max PCB Size | 510×510mm | 610×610mm |
| Min PCB Size | 120×70mm | 120×70mm |
| PCB Top Clearance | 120mm | 120mm |
| PCB Bottom Clearance | 60mm | 60mm |
| PCB Edge Clearance | 4mm | 4mm |
| Conveyor Height from Ground | 900±50mm | 900±50mm |
| Track Width Adjustment Range | 70-510mm | 70-610mm |
| Overall Dimensions | 2700×1800×1700mm | 3000×1800×1700mm |
| Flux System | ||
| Spray Height | 60mm | 60mm |
| Positioning Speed | ≤800mm/s | ≤800mm/s |
| Positioning Accuracy | ±0.05mm | ±0.05mm |
| Flux Tank Capacity | 2L | 2L |
| Preheating System | ||
| Preheating Temperature Range | 0-200℃ | 0-200℃ |
| Preheating Temperature Control Accuracy | ±2℃ | ±2℃ |
| Bottom Preheating Power | 12KW (Infrared) | 15KW (Infrared) |
| Top Preheating Power | 5KW (Hot Air) | 5KW (Hot Air) |
| Soldering System | ||
| Max Wave Height | 5mm | 5mm |
| Solder Pot Capacity (Single Pot) | 13kilos | 13kilos |
| Max Soldering Temperature | 320℃ | 320℃ |
| Required Nitrogen Purity | 99.999% | 99.999% |
| Nitrogen Consumption (Single Pot) | 25L/Min | 25L/Min |
| Positioning Accuracy | ±0.075mm | ±0.075mm |
Équipement automatique de soudage à la vague sélective
