AOI Automatic Visual Soldering Machine integrates automatic soldering with AOI (Automatic Optical Inspection) technology, completing solder paste application, soldering, and real-time defect detection (e.g., cold solder, solder bridges, insufficient solder) in one workflow. It ensures precise solder positioning and consistent joint quality through high-resolution visual recognition.
Widely used in electronics manufacturing—such as PCB assembly, sensor welding, and small component soldering in consumer electronics (smartphones, wearables). It adapts to various solder types (lead-free, tin-lead) and component sizes, supporting both batch production and flexible manufacturing, while reducing manual inspection costs.
AOI Automatic Visual Soldering Machine merges automatic soldering with advanced optical inspection, streamlining PCB assembly and small-component welding into a single efficient process. It handles solder paste application, precise soldering, and real-time defect detection—spotting cold solder, bridges, or insufficient solder—all guided by high-resolution visual recognition to ensure consistent joint quality.
This machine excels in electronics manufacturing, from smartphone components and wearables to sensor assemblies. It adapts to lead-free and tin-lead solder types, accommodating various component sizes with adjustable parameters that let operators switch between production runs quickly. The integrated AOI system eliminates the need for separate inspection stations, cutting production time and reducing manual error.
What makes this AOI Automatic Visual Soldering Machine essential is its focus on precision and cost savings. Its visual system calibrates soldering positions to within microns, while real-time defect alerts prevent faulty products from progressing downstream. Durable industrial components support continuous operation, and the user-friendly interface simplifies setup—even for operators with limited expertise.
For electronics manufacturers needing reliable, high-volume soldering with built-in quality control, this machine delivers the accuracy, speed, and efficiency to meet tight production deadlines and strict industry standards.
| Parameter | Specification |
|---|---|
| Application Scenario | Inspection before and after SMT reflow oven |
| Optical Imaging System | Top/bottom view cameras 5MP/12MP high-speed cameras |
| Lighting Source | Multi-angle high-brightness white light |
| Optical Resolution | 4.3μm/10μm/15μm/20μm |
| Inspection Speed | Fly-shoot speed 430mm/s (at 15μm) |
| Component Defect Detection | Missing, tombstoning, side-standing, polarity reversal, rotation, offset, OCV, damage, reverse, warping, foreign matter, cold solder |
| Solder Joint Defect Detection | Solder spikes, blowholes, solder balls, insufficient/excessive solder on pads, bridging, lifted leads, gold finger contamination/scratches, roundness |
| Mini LED Defect Detection | Bonding weight issue, missing bond, flipped bond, reversed bond, offset bond, side-standing, floating, rotation, dead lamp, foreign matter, internal short circuit, offset, solder overflow, short circuit, foreign matter defect, cold solder |
| X-Y Control System | High-precision ball screw drive |
| X-Y Axis Positioning Accuracy | 10μm |
| Minimum PCB Size | 50×50mm |
| Maximum PCB Size | A200T: 470×510mm; A200T-D: 510×620mm (single-track mode), 510×330mm (dual-track mode) |
| PCB Testable Thickness | 0.6-5mm |
| PCB Conveyor Height | 880-920mm |
| Track Load Capacity | 8kg |
| Track Width Adjustment/Conveyance | Automatic width adjustment, belt conveyance |
| Maximum Component Height Limit | Top: A200T/T-D: 28-50mm; Bottom: A200T/T-D: 60mm |
| Weight | 750kg; -D model: 900kg |
| Power Requirement | 200-240V, single-phase, 50/60Hz, 3kVA |
| Air Supply Requirement | 5-6 bar |
| Software | Offline programming software (standard); Repair station & SPC management system (optional); Deep learning system (optional) |
AOI Automatic Visual Soldering Machine
